Bringing Advanced Microelectronics to Revolutionary Defense Applications

By: OUTREACH@DARPA.MIL

Direct Link to Article Highlight Archives

HDIAC Highlight

DARPA's Electronics Resurgence Initiative (ERI) seeks to create a more specialized, secure, and heavily automated electronics industry. This image outlines the continued expansion of the research efforts that underlie ERI, including a focus on accelerating the delivery of ERI-derived innovations for defense applications. On December 19, 2018, DARPA will host a Proposers Day to convene leaders within the defense industry base to discuss opportunities to further develop and demonstrate ERI’s technological advances for DOD needs. (Courtesy of DARPA)

Today’s critical Department of Defense (DOD) systems and platforms rely on advanced electronics to address national security objectives. To help tackle obstacles facing a half-century of electronics advancement, DARPA launched the Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic electronic systems. In November, DARPA expanded ERI with the announcement of ERI Phase II, which seeks to further enmesh the technology needs and capabilities of the defense enterprise with the commercial and manufacturing realities of the electronics industry.

One key focus of ERI Phase II is on developing connections between the various ERI programs and their potential defense applications. On Wednesday, December 19, DARPA therefore plans to host a Proposers Day to convene leaders within the defense industry base (DIB) to discuss opportunities to further develop and demonstrate ERI’s technological advances for DOD needs. During the event, DARPA program managers will share their ideas for potential ERI defense applications, which include but are not limited to autonomy and artificial intelligence, large-scale emulation, cybersecurity, space applications, cognitive electronic warfare, and intelligence, surveillance, and reconnaissance (ISR). To foster further dialogue and collaboration, attendees will have a chance to provide input on how best to support the transition of electronics innovations into national defense hardware.

The Proposers Day will also support the development of a potential broad agency announcement (BAA) focused on defense transitions. Tentatively titled “Electronics Resurgence Initiative: Defense Applications (ERI:DA)”, the BAA would solicit innovative proposals to develop, demonstrate, and apply emerging ERI electronic technologies to deliver significant impact on DOD capabilities.

“The success of ERI relies on cooperation with the commercial sector to address shared problems. However, as a DARPA effort, ERI must also demonstrate that its research findings bolster our nation’s defenses and help create strategic surprise,” said Dr. William Chappell, director of DARPA’s Microsystems Technology Office (MTO). “Through the ERI:DA Proposers Day and potential BAA, DARPA seeks to procure the expertise and transition support of industry and the defense community to help accelerate the delivery of ERI-derived innovations for national security needs.”

The Electronic Resurgence Initiative: Defense Applications Proposers Day will take place on Wednesday, December 19, 2018 from 9:00am to 4:00pm EST, at the Hilton Arlington, 950 N Stafford St, Arlington, Virginia. Advanced registration is required. For those unable to attend in person, registered attendees may access the event via a livestream link available on the registration page. For more information, please visit: https://www.fbo.gov/index?s=opportunity&mode=form&id=aa83296cfdd337b4ca5dc8bd4929ddef&tab=core&_cview=0.


About this Publication:

All information regarding non-federal, third party entities posted on the HDIAC website shall be considered informational, aimed to advance the Department of Defense (DoD) Information Analysis Center (IAC) objective of providing knowledge to the Government, academia, and private industry. Through these postings, HDIAC’s goal is to provide awareness of opportunities to interact and collaborate. The presence of non-federal, third party information does not constitute an endorsement by the United States DoD or HDIAC of any non-federal entity or event sponsored by a non-federal entity. The appearance of external hyperlinks in this publication and reference herein to any specific commercial products, processes, or services by trade name, trademark, manufacturer, or otherwise does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or HDIAC. HDIAC is a DoD sponsored IAC, with policy oversight provided by the Under Secretary of Defense for Research and Engineering (USD (R&E)), and administratively managed by the Defense Technical Information Center (DTIC). For permission and restrictions on reprinting, please contact publications@hdiac.org. Any views or opinions expressed on this website do not represent those of HDIAC, DTIC, or the DoD.